The debut of Ryzen 7000 by AMD encompasses more than just the CPUs themselves. Alterations are being made to the architecture of the CPU, and these alterations are being accompanied by modifications to everything from the chipset to the actual socket into which the chips are inserted. The previous time that so many things changed all at once was in 2017, which was the year when the first-generation Ryzen CPUs were first introduced.
Today, we will be presenting two different things related to Ryzen. The first thing we’ll do is take a look at the actual processors’ performance and the amount of power they consume efficiently. This one will concentrate on all of the other changes, including some that will still be with us for a long time after Ryzen 7000 becomes old news.
This article will be broken up into four sections, each of which will focus on one of the four most important aspects of the Ryzen 7000 launch: 1) the Zen 4 central processing unit (CPU), 2) the on-chip I/O die that supports the CPU’s non-CPU features and manages internal connectivity, 3) the 600-series chipsets that manage the majority of external connectivity, and 4) the physical AM5 socket that will outlive all of the other components by a few years. All of these components are grouped into four categories: 1) the Zen 4 CPU core, 2) the on-chip I/O die that manages internal connectivity,