In 2023, Chinese chipmaker Loongson will introduce the 32-Core 3D5000 Chiplet CPU for servers.

The Chinese semiconductor manufacturer Loongson has successfully confirmed its next-generation 32-Core 3D5000 CPUs. These CPUs will arrive in 2023 and employ a chipset architecture.

Loongson has developed a 32-core CPU for their 3D5000 server, which is aimed at the Chinese domestic server market. The overall cache capacity is 64MB, and the designs are proprietary.
Because Loongson Technology has restricted access to China for sourcing resources, particularly in the production of next-generation CPUs, the company has been forced to adapt to new technologies, such as designs based on chipsets. The business has created a new chip called the 3D5000 CPU. It employs a chipset architecture and provides 32 cores that may be used in various server configurations.

The 3D5000 is one of several processors the business has produced in its extensive product range. The 3C5000 processor, which was created before and is still in use today, uses sixteen LA464 cores.

The “LA” core developed by Loongson Technology utilizes a unique microarchitecture known as LoongArch. This core is a component of the Godson III series. The 3C5000 features a total cache capacity of 64 MB, four 64-bit DDR4 memory interfaces, a bandwidth of 3200 MHz, and support for ECC, and all of these specifications come with DDR4 memory.

To construct the 32-core 3D5000 server-based CPU, Loongson Technology employs the utilization of two 3C5000 CPUs. Servers capable of using Loongson Technology’s 3D5000 CPU can have a maximum core arrangement of 128 cores if they have a power consumption range of 130 to 170 watts and a bandwidth range of 2.00 to 2.20 GHz, respectively. The new processor supports up to four ways of multiprocessor configurations on its single architecture and provides eight memory lanes for each design.

In 2023, the Chinese chipmaker Loongson plans to release a 32-core version of its 3D5000 Chiplet CPU for servers.

The SPEC CPU 2006 benchmark is an application suite for measuring the performance of processors. It contains a compiler and a memory subsystem, putting a strain on the processor to determine how well it performs. This test is a standardized version of the industry’s processor test. Recent testing and benchmarking of the Loongson 3D5000 resulted in scores of 400 points for the SPEC CPU 2006 test in basic tests and over 800 points in the benchmark when a two-way 32-core configuration was used. The corporation may ultimately score more than 1600 points in a four-way design; however, doing so at the time this article was written was not tested.

Manufacturing the most recent chips has been challenging for Loongson, mainly due to the company’s multi-core designs and limited availability of raw materials. Loongson has focused on chipset technology designs since resources are increasingly limited.

In contrast to TSMC, the chip manufacturer SMIC got off to a sluggish start when embracing the brand-new modular technology. SMIC manufactures loongson chips. Because of this, the firm is at a disadvantage because it cannot compete with major technology manufacturers like Intel and AMD, which are the market leaders.

The procedure to ship the new processors during the first part of the next year has been launched by Loongson Technology, and commercialized models will follow shortly after.